| ³í¹®¸í |
°øµ¿ÁÖÅà ³Ã¹æ¿¡³ÊÁöÀý°¨À» À§ÇÑ PCM Ãà¿ °ÇÀÚÀçÀÇ ÀûÁ¤ »óº¯È¿Âµµ ºÐ¼® / An analysis of Optimal Phase Change Temperature of PCM using wallboard for Cooling Energy Savings in Apartment Buildings |
| ÀúÀÚ¸í |
¾È»ó¹Î ; Á¤Ã¢Çå ; Ȳ¼®È£ ; À̽º¹ ; ±èÅ¿¬ |
| ¼ö·Ï»çÇ× |
Ãß°èÇмú¹ßÇ¥´ëȸ, 2010 (2010-10) |
| ÆäÀÌÁö |
½ÃÀÛÆäÀÌÁö(141) ÃÑÆäÀÌÁö(4) |
| ÁÖÁ¦¾î |
»óº¯È¹°Áú ; PCMº¸µå ; Ãà¿ ; »óº¯È¿Âµµ ; ¿¡³ÊÁöÀý¾à ; Phase change materials ; PCM wallboard ; Thermal storage ; Phase change temperature ; Energy savings |
| ¿ä¾à2 |
The purpose of this study is to evaluate the cooling energy reduction performance of PCM wallboard in apartment buildings by using ESP-r simulation program. A PCM wallboard, which is constructed from the micro-encapsulated phase change materials as a uniform mixture with the conventional gypsum, is applied on the inside wall surfaces in the simulation model. The results show that the application of such materials for lightweight construction makes it possible to reduce fluctuation of inner temperature and energy consumption. Considering cooling load reduction, PCM designed whose solidification temperature close to the cooling set point temperature is appropriate in aparment buildings. |